Global 3D Semiconductor Packaging market outlook 2024, Forecast To 2033
27 Feb, 2024
The 3d semiconductor packaging market size has surged in recent years, rising from$13.66 billion in 2023 to$16.01 billion in 2024 with a notable compound annual growth rate (CAGR) of 17.2%. This growth in the historic period finds its roots in various factors including miniaturization and performance demands, advancements in semiconductor technologies, increased demand for high-performance computing, and the growth of IoT and wearable devices. The market is poised for rapid expansion in the upcoming years, projected to reach$29.17 billion in 2028 at a CAGR of 16.2%. This anticipated growth is attributed to factors such as the increasing complexity of integrated circuits, continued demand for miniaturization, heightened focus on thermal management, the demand for higher bandwidths, and substantial investments in research and development. Notable trends in the forecast period include a focus on research and development, the emergence of thermal management solutions, the deployment of 5G technology, and the evolution of consumer electronics.
Global 3D Semiconductor Packaging Market Key Driver
Increasing the functionality and application scope of semiconductor or IC packages is expected to propel the growth of the 3D semiconductor packaging market going forward. A semiconductor is a solid substance with conductivities between an insulator and a conductor. The IC packaging is a common method for boosting integration density and performance in a single package. For instance, in December 2021, according to a report shared by the Semiconductor Industry Association, a US-based trade association of the United States semiconductor industry, semiconductor sales in the world reached $48.8 billion in October 2021, up 2.4% from the $39.4 billion in October 2020 and is expected to rise 26% in 2021 and surpass $600 billion in 2022. Therefore, increasing the functionality and application scope of semiconductor or IC Packages is driving the 3D semiconductor packaging market. The 2023 market size for the 3D semiconductor packaging market showcased substantial growth, bolstered by advancements in semiconductor technologies. Furthermore, the market is anticipated to witness continued expansion in 2024, fueled by innovations in semiconductor packaging methodologies and increased integration capabilities.
Get A Free Sample Of The Global 3D Semiconductor Packaging Market ReportGlobal 3D Semiconductor Packaging Market Segments
The 3d semiconductor packaging market covered in this report is segmented –
1) By Type: 3D Through Silicon Via, 3D Package On Package, 3D Fan Out Based, 3D Wire Bonded
2) By Material: Organic Substrate, Bonding Wire, Leadframe, Encapsulation, Resins, Ceramic Packages, Die Attach Material, Other Materials
3) By Industry: Electronics, Industrial, Automotive and Transport, Healthcare, IT andTelecommunication or Aerospace and Defense
By Geography: The regions covered in the 3d semiconductor packaging market report are Asia-Pacific, Western Europe, Eastern Europe,North America, South America, Middle East, and Africa.
Asia-Pacific was the largest region in the 3D semiconductor packaging market share in 2023. The regions covered in the 3d semiconductor packaging market report are Asia-Pacific, Western Europe, Eastern Europe, North America, South America, Middle East, Africa.
Major 3D Semiconductor Packaging Industry Players
Amkor Technology Inc., austriamicrosystems AG, Advanced Semiconductor Engineering Inc., International Business Machines Corporation, Jiangsu Changjiang Electronics Technology Co. Ltd., Qualcomm Technologies Inc., Samsung Electronics Corporation Ltd., Siliconware Precision Industries Co. Ltd., STMicroelectronics NV, SÜSS MICROTEC SE, Taiwan Semiconductor Manufacturing Company Limited, 3M Company, Advanced Micro Devices Inc., Walton Advanced Engineering Inc., China Wafer Level CSP Co. Ltd., Chipbond Technology Corporation, Chipmos Technologies Inc., Lingsen Precision Industries Ltd., Micron Technology Inc., Powertech Technology Inc., Tokyo Electron Ltd., Toshiba Corporation, Unisem, United Microelectronics Corporation, United Test and Assembly Center Ltd., ON Semiconductor, Renesas Electronics Corporation, Skyworks Solutions, Inc., Analog Devices, Inc., Broadcom Inc., Cypress Semiconductor Corporation, Maxim Integrated, Microchip Technology Inc., Texas Instruments Incorporated
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3D Semiconductor Packaging Market Overview
3D semiconductor packaging refers to 3D integration systems that achieve vertical stacking through standard interconnection methods such as wire bonding and flip chips. It is used to improve the performance of electrical devices that operate at high frequencies.
3D Semiconductor Packaging Global Market Report 2023 provides data on the global 3d semiconductor packaging market such as market size, growth forecasts, segments and geographies, competitive landscape including leading competitors’ revenues, profiles and market shares. The 3d semiconductor packaging market report identifies opportunities and strategies based on market trends and leading competitors’ approaches.