Global High Density Interconnect Market Growth Drivers 2024, Forecast To 2033
8 Mar, 2024
The high density interconnect market has witnessed rapid growth, expanding from $15.05 billion in 2023 to $16.71 billion in 2024, with a compound annual growth rate (CAGR) of 11.1%. This growth is attributed to factors such as the miniaturization of electronics and the increasing demand for mobile devices. Looking ahead, the market is expected to see rapid growth, reaching $24.82 billion by 2028, with a CAGR of 10.4%. This growth is driven by factors such as the implementation of 5G technology and the rise in Internet of Things (IoT) devices. Major trends in the forecast period include advancements in PCB design and semiconductor technology, reflecting the continuous innovation and evolution of electronic devices and systems.
Global High Density Interconnect Market Key Driver
The expanding application of the automotive industry is set to propel growth in the high-density interconnect market. With new vehicle sales reaching 11,471 thousand units in 2021, the automotive sector presents a burgeoning market for high-density interconnect technology. This technology, offering improved performance and reliability, is increasingly indispensable in modern vehicles, thus driving market expansion.
Get A Free Sample Of The Global High Density Interconnect Market ReportGlobal High Density Interconnect Market Segments
The high density interconnect market covered in this report is segmented –
1) Type:Single Panel, Double Panel, Other Types
2) Substrate:Rigid, Flexible, Rigid-Flex
3) End User:Automotive, Consumer Electronics, Telecommunications, Medical, Other End-Users
By Geography: The countries covered in the high density interconnect market report are Australia, Brazil, China, France, Germany, India, Indonesia, Japan, Russia, South Korea, UK, USA, Canada, Italy, Spain.
Asia-Pacific was the largest region in the high-density interconnect market in 2023 and is expected to be the fastest-growing region in the high-density interconnect market report during the forecast period. The regions covered in the high density interconnect market report are Asia-Pacific, Western Europe, Eastern Europe, North America, South America, Middle East, Africa.
Major High Density Interconnect Industry Players
Unimicron Technology Corporation; TTM Technologies Inc.; Austria Technologie & Systemtechnik AG; Zhen Ding Tech. Group; Meiko Electronics Co. Ltd.; Fujitsu Limited; Multek Corporation; NCAB Group; Sierra Circuits Inc.; Ibiden Co. Ltd.; Samsung Electro-Mechanics; Unitech Printed Circuit Board Corp.; Empresa Provincial de Energía de Córdoba; CMK Corporation; Nan Ya Printed Circuit Board Corporation; RayMing Technology Co.Ltd; Advanced Circuits Inc.; Calumet Electronics Corporation; ChinaPCBOne Technology Limited; Epec Engineered Technologies; Flex PCB Inc.; Hemeixin Electronics Co. Limited; King Sun PCB Technology Co. Ltd.; Moko Technology Limited; RUSH PCB Inc; XPCB Limited; Sunstone Circuits LLC; 3CEMS Group.
Get The Full Global High Density Interconnect Market Report
High Density Interconnect Market Overview
High-density interconnect (HDI) is a printed circuit board (PCB) that enables placing more components on the same board space. It is used to reduce the size of the PCB while adding more functionality and features to a single board.